电子设备热设计技术QQ群:102886397 

课程简介

本课程介绍T3ster在半导体器件分装热特性测试中的原理和相关知识，举例概述了T3ster在功率 LED 特性、热模型检验和确认中的具体使用。

课程目录

第1课：Introduction to DynTIM

第2课：Parametric Study of an IGBT Cold Plate Geometry in Thermal Simulation

第3课：Laser Headlamps: Latest Developments and Future Prospect 

第4课：Selecting the right Thermal Interface Material (TIM) for electronics packags based on accurate thermal measurement data

第5课：Quality Control at the Electronic Package and System Levels

第6课：Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration

第7课：Thermal testing standards: JEDEC Standards – What’s the latest news?

第8课：LED Thermal Characterization Made Easy

第9课：T3Ster Validation of Thermal Models of IC Packages and More

第10课：Understanding the thermal impedances in power LED applications

第11课：Testing Thermal Interface Material (TIM) Analysis 

第12课：Long Term Reliability in Electronic Systems

第13课：System Level Thermal Testing 101

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课程时长：9.4h

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